Analysis of the quality of the welding process in the exchange of component of BGA technology
In recent years, many efforts have been expended by companies in the search for technological improvement of their products by adding features such as lightweight materials, reduced size and high levels of performance at the lowest cost, to meet a worldwide demand in this regard. This article aimed to conduct an analysis of the quality of the Reflow of soldering in exchange of component of BGA technology. The methods and techniques used were the qualitative-quantitative approach, conducted by the case study technique in the welding process of the BGA component by collecting (cross section and X-ray) and data analysis (alignment, cracks and voids) within the process. The achieved results showed that the Reflow welding process in the exchange of BGA component meets the criteria for acceptance of international standards IPC -A - 610E and IPC 7095B. This fact leads to the inference that the quality of the process in question may reflect in better conditions and cost competitiveness for the investigated organization.
Y. Lee, K. Kim and K. Suganuma, “The effect of microvia-in-pads design on SMT defects in ultra-small component assembly”, in 11st International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Xi’an, China, 2010, pp. 870-875.
C. Liu, J. Wang, A. Zhang and H. Ding, “Research on the fault diagnosis technology of intermittent connection failure belonging to FPGA solder-joints in BGA package”, Optik Optics, vol. 125, no. 2, pp. 737-740, 2014.
J. Priede, “Implementation of Quality Management System ISO 9001 in the World and its Strategic Necessity”, Procedia - Social and Behavioral Sciences, vol. 58, pp. 1466-1475, 2012.
C. Yang, F. Song, S. Lee and K. Newman, “Comparative Study of PWB Pad Cratering Subject to Reflow Soldering and Thermal Impact”, in 60th Electronic Components and Technology Conference (ECTC), Las Vegas, USA, 2010, pp. 464-470.
J. Childs, “How Lead-Free Changes Can Impact Reliability”, IEEE Reliability Society Annual Technology Report, pp. 1-7, 2008.
S. Ganesan and M. Pecht, Lead-Free Electronics, 1st ed. USA: Wiley-Interscience, 2004.
F. Wang, J. Qin, L. Han and H. Wang, “Height Measurement of Micro-Solder Balls on Metal Pad by White Light Projection”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 2, no. 9, pp. 1545-1549, 2012.
S. Stoyanov, A. Dabek and C. Bailey, “Thermo– Mechanical Sub–Modelling of BGA Components in PCB Reflow”, in 36th Int. Spring Seminar on Electronics Technology (ISSE), Alba Iulia, Romania, 2013, pp. 253-258.
N. Lee, Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies, 1st ed. USA: Newnes, 2002.
J. Jirsa, K. Dušek and P. Černek, “Risk Analysis of Reflow Technologies in Electronics Assembly”, in 35th Int. Spring Seminar on Electronics Technology (ISSE), Bad Aussee, Austria, 2012, pp. 178-182.
M. Ayob and G. Kendall, “A survey of surface mount device placement machine optimisation: Machine classification”, European Journal of Operational Research, vol. 186, no. 3, pp. 893-914, 2008.
T. Tsai, “Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: A comparative study”, Applied Soft Computing vol. 12, no. 8, pp. 2601-2613, 2012.
P. Wood and H. Rupprecht, “Chapter 19: BGA and CSP Rework: What’s is Involved?”, in Area Array Packaging Handbook: Manufacturing and Assembly, 1st ed., K. Gilleo (ed). USA: McGraw-Hill, 2002.
IPC (Association Connecting Electronics Industries), Acceptability of Electronic Assemblies, Standard IPC-A-610E, 2010.
IPC (Association Connecting Electronics Industries), Design and Assembly Process Implementation for BGAs, Standard IPC-7095B, 2008.
K. Puttlitz and G. Galyon, “Impact of the ROHS directive on high-performance electronic systems—Part I”, Journal of Materials Science: Materials in Electronics, vol. 18, pp. 331-346, 2006.
M. Erinc, P. Schreurs and M. Geers, “Integrated numerical–experimental analysis of interfacial fatigue fracture in SnAgCu solder joints”, International Journal of Solids and Structures, vol. 44, no. 17, pp. 5680-5694, 2007.
J. Pan, B. Toleno, T. Chou and W. Dee, “The Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear strength”, Soldering & Surface Mount Technology, vol. 18, no. 4, pp. 48-56, 2006.
T. Yamamoto and K. Tsubone, “Assembly Technology Using Lead-free Solder”, FUJITSU Sei. Tech. J., vol. 43, no. 1, pp. 50-58, 2007.
C. Lau, M. Abdullah and F. Ani, “Effect of Solder Joint Arrangements on BGA Lead-Free Reliability During Cooling Stage of Reflow Soldering Process”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 2, no. 12, pp. 2098-2107, 2012.
R. Yin, Case Study Research: Design and Methods, 4th ed. USA: SAGE, 2009.
W. Lin, “The Void-free Reflow Soldering of BGA with Vacuum”, in 8th International Conference on Electronic Packaging Technology (ICEPT), Shanghai, China, 2007, pp. 1-5.
L. Nie, M. Osterman and M. Pecht, “Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies”, in IPC APEX EXPO, Las Vegas, USA, 2009.
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