Study by X-ray diffraction of the residual stress produced during deposition of TiN thin films on metallic substrates

Authors

  • Mónica Monsalve University of Antioquia
  • Esperanza López University of Antioquia
  • Juan Meza National University of Colombia
  • Fabio Vargas University of Antioquia

Keywords:

X-ray diffraction, titanium nitride, thin films, residual stresses

Abstract

The influence of film thickness and the substrate type on the level and type of residual stresses generated on TiN coatings are analyzed. Two different physical vapor deposition (PVD) techniques: Magnetron Sputtering and Ion Plating were applied. Two materials were used as substrate: stainless steel AISI 304 and AISI M2 tool steel. The study of the residual stresses, the present phases, the crystalline structure and the crystallographic texture of the deposited films was performed by X-ray diffraction analysis using the grazing method with a low incidence angle. The results show that the residuals stresses produced by both deposition techniques were of compression and that their level decreased by increasing the film thickness. Moreover, the residual stresses were higher in those coatings deposited by Magnetron sputtering than coatings produced by Ion Platting. The residuals stresses in the films deposited on the AISI 304 steel were greater than those produced in AISI M2 steel. This is due to the delivery energy mechanism to the layer growth and momentum of the ionized particles, which directly influence the microstructure and increase or decrease residual stresses. Regarding the substrate, residuals stresses were greater on the films produced on AISI 304 steel, than those deposited on the AISI M2 steel, which is possibly due to the lower coefficient of thermal expansion of M2 steel.

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Author Biographies

Mónica Monsalve, University of Antioquia

Department of Metallurgical and Materials Engineering.

Esperanza López, University of Antioquia

Department of Metallurgical and Materials Engineering.

Juan Meza, National University of Colombia

Faculty of Mines, Materials Science and Technology Group -CTM.

Fabio Vargas, University of Antioquia

Faculty of Mines, Materials Science and Technology Group -CTM.

References

C. Mendibide, P. Steyer, C. Esnouf, P. Goudeau, D. Thiaudière, M. Gailhanou, J. Fontaine. “X- ray diffraction analysis of the residual stress state in PVD TiN/CrN multilayer coatings deposited on tool steel”. Surface and coatings technology. Vol 200. 2005. pp. 165-169.

F. Álvarez. “Procesamiento de materiales por plasma. Técnicas de recubrimientos por plasma CVD”. CNEA Tercer curso latinoamericano. Buenos Aires. 2000. pp. 81-103.

L. Pawlowski. The science and engineering of thermal spray coatings . Ed. John. Wiley and Sons Ltda. West Sussex. Londres. 1995. pp. 28-50.

H. Dislich. “Thin films from the Sol-Gel process”. Sol gel technology for thin films, fibers, preforms, electronics and specialty shapes. L. Klein (editor). Ed. Noyes Publications. New York. (USA). 1998. pp. 50-76.

R. F. Bunshah, L. Hultman, J. Sundgren. “Handbook of hard coating. Deposition Technologies, properties and aplications.” Structure/Property Relationships for hard Coatings. Ed. Noyes Publications. New York (USA). 2001. pp. 211-223.

R. Wiedemann, H. Oettel. “Residual stress in PVD hard coatings”. Surface and Coatings Technology. Vol. 76-77. 1995. pp. 265-273.

J. M. Meza. “Técnicas de indentación aplicadas al estudio de propiedades mecánicas de recubrimientos de nitruro de titanio”. Tesis de Maestría. Universidad Nacional de Colombia. Sede Medellín. Escuela de Ingeniería de Materiales. 2004. pp. 44-45.

C. V. Franco, L. C. Fontana, D. Bechi, A. E. Martinelli, J. L. R. Muzart. “An Electrochemical Study on Magnetron Sputtered Ti and Tin Coated steel”. Corrosion Science. Vol. 40. 1998. pp. 103-112.

ICSD (Inorganic crystal structure database). FIZ. Karlsruhe. 2007.

V. Benavides. Crecimiento y caracterización de bicapas TiN/TiC por la técnica PAPVD por arco pulsado. Trabajo de grado. Ingeniería Física. Universidad Nacional de Colombia. Sede Manizales. 2005. pp. 82- 122.

R. C. Sun, T. C. Tisone, P. D. Cruzan. “Internal stresses and resistivity of low voltaje sputtered tungsten films”. J. Appl. Phys. Vol. 44. 1975. pp. 1009-1016.

R. C. Sun, T. C. Tisone, P. D. Cruzan. “The origin of Internal stresses in low voltaje sputtered tungsten films”. J. Appl. Phys. Vol. 46. 1975. pp. 112-117.

E. Zoestberg, J. M Carvalho. “Stress state of TiN/ TiAlN PVD multilayers”. Surface Engineering. Vol. 17. 2001. pp. 29-34.

R. K. Nandi, S. P Gupta. “Residual stress measurement in hexagonal zinc films from x-ray peak shift análisis”. J. Phys D: Appl. Phys. Vol. 10. 1977. pp. 1479-1485.

J. H. Huang, F. Y. Ouyang, G. P. Yu. “Effect of film thickness and Ti interlayer on the structure and properties of nanocrystalline TiN thin films on AISI D2 steel”. Surface & Coatings Technology. Vol. 201. 2007. pp. 7043-7053.

S. Sen, S. K. Halder, S. P. Sen Gupta. “An X-ray line shift análisis in vacuum-evaporated silver films”. J. Appl Phys. Vol. 6. 1973. pp. 1978- 1985.

F. Kunc, J. Musil, P. H. Mayrhofer, C. Mitterer. “Low-stress superhard Ti-B films prepared by magnetron sputtering”. Surface and coatings Technology. Vol. 174-175. 2003. pp. 744-753.

O. Ceh, L. García González, J. Morales Hernández, F. J Espinosa Beltrán, A. I. Oliva. “Estudio de esfuerzos intrínsecos y dureza de recubrimientos de TiN/c-Si fabricados por la técnica de evaporación por arco eléctrico”. Superficies y Vacío. Vol. 14. 2002. pp. 15-20.

H. Savaloni, A. Taherizadeh, A. Zendehnam. “Residual stress and structural characteristics in Ti and Cu sputtered films on glass substrates at different substrate temperatures and film thickness”. Physica B. Vol. 349. 2004. pp. 44-55.

S. G. Malhotra, Z. U. Rek, S. M. Yalisove, J. C. Bilello. “Analysis of thin film stress measurement techniques”. Thin Solid Films. Vol. 301. 1997. pp. 45–54.

M. Bielawski. “Residual stress control in TiN/ Si coatings deposited by unbalanced magnetron sputtering”. Surface & Coatings Technology. Vol. 200. 2006. pp. 3987-3995.

J. H. Hsieh, C. Li, W. Wu, R. F. Hochman. “Effects of energetic particle bombardment on residual stress, microstrain and grain size of plasma-assisted PVD Cr thin films”. Thin Solid Films. Vol. 424. 2003. pp. 103-106.

L. Hultman. “Thermal stability of nitride thin Films”. Vacuum. Vol. 57. 2000. pp. 1-30.

A. Rodrigo. Efecto de las variables de procesos reactivos de deposición por plasma sobre las propiedades de recubrimientos duro”. Tercer curso latinoamericano. Procesamiento de materiales por plasma. CNEA. JICA. Buenos Aires. 2000. pp. 141-162.

C. V. Franco, L. C. Fontana, D. Bechi, A. E. Martinelli, J. L. R. Muzart. “An electrochemical study on magnetron sputtered Ti and TiN coated steel”. Corrosion Science. Vol 40. 1998. pp. 103-112.

J. D. Culcasi, C. I. Elsner, A. R. Di Sarli. “Efecto del tamaño de cristales de cinc sobre la deformación y el comportamiento electroquímico de aceros galvanizados”. 17º CBECIMat - Congresso Brasileiro de Engenharia e Ciência dos Materiais. Foz do Iguaçu. PR. Brasil. 2006. pp. 5276-5287.

E. Zoestbergen. X-ray analysis of protective coatings. Tesis Ph.D. Groningen: Rijksuniversiteit Groningen. 2000. pp. 17-18, 38-44.

J. E. Alfonso, F. Pacheco, C. Moreno, R. Garzón, J. Torres. “Recubrimientos De TiN realizados mediante magnetrón”. Revista Colombiana de Física. Vol. 35. 2003. pp. 47-51.

Published

2010-01-22

How to Cite

Monsalve, M., López, E., Meza, J., & Vargas, F. (2010). Study by X-ray diffraction of the residual stress produced during deposition of TiN thin films on metallic substrates. Revista Facultad De Ingeniería Universidad De Antioquia, (54), 32–41. Retrieved from https://revistas.udea.edu.co/index.php/ingenieria/article/view/14162